MIM Thermal Solutions with Copper

As industries push the limits of performance, thermal management is becoming the critical bottleneck.

From EV power modules and AI servers to 5G base stations, the demand for higher power density means heat must be managed more effectively than ever. Traditional solutions — like machined copper or aluminum parts — struggle with cost, design limitations, or scalability.

This is where MIM (Metal Injection Molding) copper components bring a new advantage:

• High thermal conductivity – up to 360 W/m·K, enabling efficient heat dissipation.
• High density – up to 8.75 g/cm³, delivering superior thermal and electrical performance.
• Complex geometry capability – microchannels, integrated designs, and shapes that are hard to achieve with CNC machining.

The outcome for our partners?

1. Lower junction temperatures and extended device lifetime
2. Faster design-to-production cycle with scalable manufacturing
3. Better balance of performance, cost, and reliability

We're now collaborating with industry partners to co-develop prototypes and validate designs, paving the way for next-generation cooling solutions across automotive, electronics, and telecom sectors.

Contact us now for more info.